temperature/Industrial eMMC
Work around the clock for extended periods in harsh environments
The high reliability and long service life ensure working around the clock for extended periods.
The mean time between failures (MTBF) exceeds 20 million hours.
The product not only has good read/write performance and reliability but also helps reduce the CPU platform development difficulties.
Product Parameter
| Product Series | PN | NAND Flash | Capacity | Interface/Protocol | Package | Operating Temperature | Voltage | Size |
|---|
| Automotive eMMC Grade2 | KINGPINS004G-A8A39 | pSLC | 4GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade2 | KINGPINS008G-A8A39 | MLC | 8GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade2 | KINGPINS008G-A8A43 | pSLC | 8GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade2 | KINGPINS016G-A8A43 | MLC | 16GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade2 | KINGPINS032G-A8A58 | MLC | 32GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade2 | KINGPINS064G-A8A58 | MLC | 64GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.2 mm |
| Automotive eMMC Grade3 | KINGPINS008G-88A39 | MLC | 8GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade3 | KINGPINS016G-88A43 | MLC | 16GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade3 | KINGPINS032G-88A19 | 3D NAND | 32GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade3 | KINGPINS064G-88A19 | 3D NAND | 64GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Automotive eMMC Grade3 | KINGPINS128G-88A19 | 3D NAND | 128GB | eMMC 5.1 | FBGA153 | -40°C~105°C | 1.8V/3.3V | 11.5×13×1.2 mm |
| Industrial Wide-Temperature eMMC | KINGPINS008G-88A39 | MLC | 8GB | eMMC 5.1 | FBGA153 | -40℃~85℃ | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial Wide-Temperature eMMC | KINGPINS016G-88A43 | MLC | 16GB | eMMC 5.1 | FBGA153 | -40℃~85℃ | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial Wide-Temperature eMMC | KINGPINS032G-88A19 | 3D NAND | 32GB | eMMC 5.1 | FBGA153 | -40℃~85℃ | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial Wide-Temperature eMMC | FEMDRW064G-88A19 | 3D NAND | 64GB | eMMC 5.1 | FBGA153 | -40℃~85℃ | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial Wide-Temperature eMMC | KINGPINS128G-88A19 | 3D NAND | 128GB | eMMC 5.1 | FBGA153 | -40℃~85℃ | 1.8V/3.3V | 11.5×13×1.2 mm |
| Industrial eMMC | KINGPINS008G-58A39 | MLC | 8GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINS016G-58A43 | MLC | 16GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINS032G-A3A55 | 3D NAND | 32GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINSSLD-32G | 3D NAND | 32GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINSSLD-64G | 3D NAND | 64GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINS064G-A3A56 | 3D NAND | 64GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINS128G-A3A56 | 3D NAND | 128GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.0 mm |
| Industrial eMMC | KINGPINSSLD-128G | 3D NAND | 128GB | eMMC 5.1 | FBGA153 | -25°C~85°C | 1.8V/3.3V | 11.5×13×1.2 mm |